| 摘要 |
PURPOSE:To provide a thin or small-sized molding with a circuit and, at the same time to provide a manufacturing method for massproducing the molding. CONSTITUTION:Circuit section forming goods 31, 32, and 33 formed of a resin material containing a plating catalyst are integrally molded with a housing formed of another resin material containing no plating catalyst in such a way that the goods 31, 32, and 33 can be pulled out from the housing 22 in one direction and closely adhered to the housing 22 so that no gap can be formed between the goods 31, 32, and 33 and housing 22. Therefore, the housing 22 is injected by molding and the circuit section forming goods 31, 32, and 33 are injection-molded by forming. Namely, they are molded with a reversal mold type injection molding machine. |
