发明名称 CUT CLAMP FOR WIRE BONDING DEVICE
摘要 PURPOSE:To improve the quality and the device availability in automatic bonding by removing the slippage of the clamp face of a cut clamp in clamping of a gold wire. CONSTITUTION:This has a structure for introducing air into the rubber in clamping of a gold wire 2 and controlling clamp operation by air pressure by using rubber as the material of the clamp face 1a of a cut clamp 1 and making the shape semicircular, in an automatic wire bonding device.
申请公布号 JPH0555290(A) 申请公布日期 1993.03.05
申请号 JP19910217668 申请日期 1991.08.29
申请人 NEC YAMAGUCHI LTD 发明人 HIDAKA KEISUKE
分类号 H01L21/60 主分类号 H01L21/60
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