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发明名称
COATING METHOD FOR PAD WITH SOLDER
摘要
申请公布号
JPH0555729(A)
申请公布日期
1993.03.05
申请号
JP19910211708
申请日期
1991.08.23
申请人
FUJITSU LTD
发明人
TAKADA MICHIAKI;FUKUOKA AKIRA
分类号
H05K3/24;H05K3/34;H05K3/40
主分类号
H05K3/24
代理机构
代理人
主权项
地址
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