| 摘要 |
<p>PURPOSE:To provide a method of trimming a ceramic wiring board wherein short circuit is not caused, its resistance value can be increased, an irregularity in its resistance value is reduced and heat-resistant property is excellent. CONSTITUTION:In the method of trimming a laminated thick-film ceramic wiring board, wherein a platinum thick-film conductive pattern 2a as the uppermost layer which has been formed on a ceramic board 1a is trimmed by a laser beam, a ceramic coating layer 3 is formed on the conductive pattern 2a. The method of trimming the ceramic wiring board is featured by the following steps: the conductive pattern 2a which is situated at the lower layer of the ceramic coating layer 3 is irradiated with the laser beam from the upper part of the ceramic coating layer 3; the conductive pattern 2a is scattered and removed partly; and the resistance is adjusted to a desired value.</p> |
