| 摘要 |
<p>PURPOSE:To prevent the surface of a semiconductor element from being cut out or damaged by raising the element so as not to peel the element from an adhesive sheet when the element is transferred to a lead frame, a substrate, etc. CONSTITUTION:When a semiconductor element separating mechanism is stored in a sheet suction stage 2 having a suction hole 1 for sucking fixedly an adhesive sheet 6. When a semiconductor element 5 is transferred from the sheet to a lead frame 10a, a board 10b, etc., by a mounting arm 9, a semiconductor element lifter 3 for extending an interval between adjacent semiconductor elements 5, and a lifting stylus 4 for peeling the element from the sheet are composed.</p> |
