发明名称 METHOD FOR PACKAGING CENTER CONDUCTOR FOR DIELECTRIC RESONATOR
摘要 PURPOSE:To fix a center conductor in the through-hole of a dielectric substance without soldering it. CONSTITUTION:In the case of packaging a round bar-like center conductor 12 to a through-hole 13 formed on the center axis of a dielectric substance 11, the conductor 12 is cooled by liquid nitrogen or the like to contract it and then inserted into the through-hole 13. The outer diameter of the cooled center conductor 12 is set up so as to be smaller than the inside diameter of the through-hole 13, and in a room temperature state, the conductor 12 is set up so as to be adhered tightly to the blank of the through-hole 13.
申请公布号 JPH0555815(A) 申请公布日期 1993.03.05
申请号 JP19910211250 申请日期 1991.08.23
申请人 NEC CORP 发明人 KUSAMITSU HIDEKI
分类号 H01P7/04;H01P11/00 主分类号 H01P7/04
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