| 摘要 |
PURPOSE:To provide a method of preventing the generation of lamination voids, enhancing the accuracy of the thickness of an insulation layer and preventing copper transfer. CONSTITUTION:An insulation board 13b having a conductor pattern 13a made of a copper foil is heated and pressed so that the conductor pattern 13a is buried in the insulation board 13b. Then, after the surface of the conductor pattern 13a and the surface of the insulation board 13b are placed flash, glass cloth is impregnated with liquid resin and a prepreg 12 dry-to-the touch and a copper film 11 are overlapped, heated, pressed and laminated, which makes it possible to prevent the resin contained in the prepreg 11 from being supplied between the inner layer conductor patterns 13a and form an insulation layer portion between an outer conductor pattern of a multilayer printed wiring board and the inner layer conductor pattern 13b in a further equalized and smooth fashion. |
