MANUFACTURE OF CERAMIC MULTILAYER WIRING BOARD

摘要

PURPOSE:To embody an excellently laminated ceramic multilayer wiring board which prevents the generation of a phenomenon which produces faulty transfer or destructive wiring patterns by manufacturing transfer sheets which have dramatically reduced an offset generated on an insulation layer by the wiring patterns in terms of a manufacturing method of a multilayer wiring board used in the field of the electronic industry. CONSTITUTION:When insulation paste is screen-printed, it is possible to manufacture transfer sheet 7 with very small steps by using a screen printed board which is arranged to enlarge a wire diameter of meshes in a part equivalent to a wiring pattern 4 formed on a base film 3 more than other parts.