| 摘要 |
PURPOSE:To provide a manufacture of a semiconductor which can improve the reliability as a package by preventing the oxidation of the lead frame on the heater plate of a wire bonder. CONSTITUTION:Even in the case that a lead frame 5 does not exist in the lead frame supply part of a wire bonder which performs wire bonding process 3, and that the wire bonder judges that it should wait lead frame supply, this completes the bonding operation of the lead frame 5 during wire bonding, and transfers it to a molding process 4. |
