| 摘要 |
PURPOSE:To fix the main surface of the mesa of an optical semiconductor device provided with a mesa groove near an active area to a heat sink material so as to avoid stress concentration in the semiconductor optical device. CONSTITUTION:This optical semiconductor device 1 is fixed to a heat sink material by using solder 104 only to the main surface of its mesa 106. As a result, the thermal stress applied to an active area 102 from the peripheral section of the element 1 at the time of soldering can be reduced and a semiconductor laser provided with a mesa groove 103 be realized by a semiconductor optical device assembly method which is high in heat radiating effect and high in reliability from the point of service life. |
