| 摘要 |
<p>PURPOSE:To obtain a tape carrier for TAB where formation of an intermetallic compound of Cu and Sn is suppressed to prevent the break of an inner lead, by providing Sn alloy plating on Zn or Zn alloy plating on the surface of a copper foil pattern lead. CONSTITUTION:On a copper pattern lead 11 excluding, at least, the inner lead, a Zn or Zn alloy plated layer is made on and further an Sn or Sn alloy plated layer 30 is formed on the surface. In this way, by applying Zn or Zn alloy plating as the base plating of Sn or Sn alloy plating, the formation of the hard intermetallic compound produced by the reaction between Cu and Sn, can be prevented, and the break of the inner lead can be prevented.</p> |
