| 摘要 |
PURPOSE:To enhance moisture proofing or the like by preventing any foam from remaining in a moisture barrier which envelops a wiring board with an electronic component mounted in a wiring board unit. CONSTITUTION:A printed wiring board 30 is laid slanting to the top 33a of a moisture barrier 33. When the printed wiring board 30 is buried in a liquid moisture barrier to be solidified, this slanted layout of the printed wiring board arrangement forces the foams built-up beneath the printed wiring board 30 to escape from the moisture barrier to the outside as shown by an arrow A. |
