MOLD DEVICE FOR SEALING SEMICONDUCTOR

摘要

PURPOSE:To provide a mold device which facilitate the repair when the cavity part of an insert is broken, in a mold device for molding by supplying fused resin into the cavity. CONSTITUTION:Only the block insert 1 is repaired even when a cavity 2 is broken by constituting inserts of a plurality of block inserts with every cavity 2, moreover this enables the measures in the case that the pitch slippage of the cavity 2 occurs.