发明名称 ELECTRODE PASTE AND ELECTRODE FORMING METHOD
摘要 <p>PURPOSE:To provide an electrode paste and an electrode forming method for ceramic electronic components, by which a gap at an electrode part can be prevented from generating, low electric resistance value can be obtained, and furthermore reliability can be enhanced. CONSTITUTION:An electrode is constituted by using an electrode paste wherein at least one kind of metal, an oxide of which has higher reducing property than that of a copper oxide, is added in an amount of 5 to 50wt.% to a copper oxide, debinder is performed at the temperature to oxidize the added metal or higher in air, and subsequently reducing treatment is performed in the atmosphere such that it becomes non-reductive to the oxide of the added metal, followed by sintering in a neutral atmosphere. Therefore, the added metal is oxidized and expanded upon debinder, only the copper oxide is reduced upon reduction, and the oxide serves as a filler upon sintering, in the electrode portion, so that a copper electrode, in which no gap is generated at the electrode portion, the electric resistance value of which is low, the reliability of which is high, can be provided.</p>
申请公布号 JPH0554713(A) 申请公布日期 1993.03.05
申请号 JP19910212029 申请日期 1991.08.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHIKAWA MARIKO;OKANO KAZUYUKI;ITAGAKI MINEHIRO;SHIRAISHI SEIGO;KIMURA RYO;TANAHASHI MASAKAZU
分类号 H01B1/16;H01B1/22;H01B13/00;H01C17/06;H05K1/09;H05K3/46 主分类号 H01B1/16
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