发明名称 MANUFACTURE OF CLAD CONTACT BAND STRIP
摘要 PURPOSE:To reduce contact height and miniaturize a clad contact by providing a groove having a rectangular section in the longitudinal direction of one side part upper surface of a base band material consisting of a Cu alloy, inlaying and cladding a band strip of Ni or Cu-Ni in the groove, and then seaming and welding a contact band strip of Ag or an Ag alloy on this band material. CONSTITUTION:A 2.0-mm-wide, 0.01-mm-deep groove 4 having a rectangular section is provided in the longitudinal direction of one side part upper surface of, for example, a 25-mm-wide, 0.08-mm-thick base band material consisting of BeCu, and a band strip 5 of Ni is inlaid and clad in the groove 4. Thereafter, a contact band material 2 of Ag having an upper surface width of 1.0mm, a lower surface width of 1.2mm and a height of 0.15mm is seamed and welded onto the band strip 5 of Ni to provide a clad contact band material 6. Since no expulsion and surface flash is formed on the band material 6 at the time of seam welding, the expulsion and surface flash is never driven into the contact surface at the time of the following pressing as in the past, and the contact material and the base material never receive striking flaws by the expulsion and surface flash. The height is reduced by the portion of inlaying the band strip 5 in the band material 1.
申请公布号 JPH0554753(A) 申请公布日期 1993.03.05
申请号 JP19910198374 申请日期 1991.07.12
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KOJIMA KIYOKAZU
分类号 B23K11/00;B23K20/04;B23K101/38;H01H11/06 主分类号 B23K11/00
代理机构 代理人
主权项
地址