| 摘要 |
PURPOSE:To facilitate the testing of a semiconductor device. CONSTITUTION:An LSI package 1 is equipped with a cap, which is detachably provided on the upper part of a semiconductor element, and a probe pad 4 which is formed by thickening a part of a lead wire 3 coming from an LSI (element) 2. As result, when a semiconductor device is tested, the cap 5 is removed, and the test is conducted by having the probe of a tester brought into contact with the probe pad 4, and after test is finished, the cap 5 is put on again. |
