Defined adhesive area prodn. esp. for micro-mechanics or integrated sensor - using photoresist adhesive soln. of lacquer, photosensitive cpd. and hardener, etc.

摘要

Prodn. of adhesive areas of definite extent for bonding parts is carried out by (a) coating a pattern with a photoresist adhesive (I), consisting of a solvent (II), a lacquer component (III), a light-sensitive component (IV) and a hardener component (V) and a solvent; (b) this is exposed and developed; then (c) 2 devices are placed in the required position and contacted under a pressure max 1g/sq.cm for max. 10 minutes and heated to 200 deg.C. Pref. (III) is a cresol/HCHO resin (IIIA) and/or its oligomers (IIIB) or poly-(hydroxystyrene); (IV) is 1,2-naphthoquinone-diazide- 2-(5-sulphonate esters) (IVA) and/or the corresp. 4-sulphonate esters (IVB) or aryl-hydroxy cpds. polyhydroxybenzophenones, esp. 2,3,4-trihydroxybenzophenone, gallate esters or cresol/HCHO condensates. (V) is phenol and/or cresol bismethylols or their ethers or esters, resols, epoxide cpds. or mixts. of these 4 cpds. USE/ADVANTAGE - The technique is useful for making contact areas with narrow limits, esp. for making functional elements with micro-cavities esp. for finishing microelectronic devices in the micro-mechanical field and integrated sensor technology. A firm bond with very small, exact areas can be made, with tolerances of a few microns or in the sub-micron range.