| 摘要 |
A heat sink cooling apparatus and a method for attaching a heat sink to a ceramic integrated-circuit package (52) are provided. An externally-threaded (64) molybdenum stud (60) is attached to and extends from a copper/tungsten slug (54), or attachment plate, which is brazed to the ceramic integrated-circuit package (52). The stud (60) and the slug (54) have similar thermal coefficients of expansion to reduce thermal stress at the interface therebetween. An aluminum heat sink (70) has an internally threaded (82) hole (80) formed therein for receiving the externally-threaded (64) molybdenum stud (60). The external threads of the harder molybdenum material engage and deform the threads (82) formed in the aluminum heat sink (70) to provide strong mechanical and thermal bonding between the stud (60) and the heat sink (70). |
