| 摘要 |
<p>Corrugated paperboards are prepared for corrugation and adhesive bonding of mediums and liners is promoted by exposing the mediums liners and adhesives to radiant energy from a thermal source ranging from 1100 °C to 2300 °C and emitting a dominant wavelength in the range of 2.1 to 1.0 microns. The speed of adhesive bond development is increased. Polymeric adhesives may be used as alternatives to conventional starch based adhesives.</p> |
