| 摘要 |
The field of the invention is that of heat sinks intended to remove the heat energy dissipated by electronic components mounted on a board. …<??>According to the invention, the heat sink consists of a plate (20) made of heat-conducting material arranged above the components (11) of the board and fixed with the aid of fixing means (24, 25) in proximity to each of the components (11), this plate (20) containing deformations (21) opposite the components (11), each deformation (21) being of spherical shape and in thermal contact with the heat source of a component (11). …<IMAGE>… |
