| 摘要 |
PURPOSE:To improve the heat resistance of a cover tape, and make it possible to perform baking process under a condition in which a lid is placed on a carrier tape in which a small sized electronic component, especially an active element such as an IC, etc., sealed by a resin is stored. CONSTITUTION:For a cover tape 1 which is attached on a carrier tape 2 with a large number of cavities to store an electronic component 4, a normal temperature adhesive resin layer 13 is formed on one surface of a transparent base film 11 of which the shrinkage factor under a heat treatment at 105 deg.C-30min is 0.5% or less, and the visible ray resin layer 13, a transparent mask film 14, which is wider than the width of the cavity 3 and narrower than said transparent base film 11, and of which the visible ray permeability is 50% or higher, is attached. |
