发明名称 MANUFACTURE OF SOLID IMAGE PICKUP ELEMENT
摘要 PURPOSE:To eliminate occurrence of defects and adherence of dusts on a solid image pickup element at the time of positional adjustment by evaporating without using a metallic mask when forming a photoelectric film and a transparent electrode forming the solid image pickup element, etching and removing unnecessary portion, thereby forming a desired shape thereat. CONSTITUTION:A picture element portion 20 having photodiodes and transfer BBD elements and a drive circuit 21 having MOS transistors and CCE element are adjacently formed on an Si substrate 19. Subsequently, a number of electrodes 25 making contact with a photoconductive film 26 forming later are formed on the surface of the portion 20, an electrode 24 is formed through an insulating film 22 at one end of the electrodes 25, and a conductive wire portion 23 is formed through the film 22 also on the circuit 21. Thereafter, the film 26 and a transparent electrode 27 are laminated on the entire surface, and a curable resin film pattern 28 is formed on prescribed portion. With the pattern as a mask it is etched, and the unnecessary portions of the film 26 and the electrode 27 are removed. Then, while the pattern 28 is retained, a color filter 30 is mounted thereon with an adhesive 29.
申请公布号 JPS5646568(A) 申请公布日期 1981.04.27
申请号 JP19790123335 申请日期 1979.09.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OGAWA KAZUFUMI;CHIKAMURA TAKAO;SHIBATA TAKUO
分类号 H01L27/14;H01L27/146;H04N5/335;H04N5/372;H04N9/07 主分类号 H01L27/14
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