APPARATUS FOR AND METHOD OF APPLYING PACKAGE FITMENTS

摘要

An apparatus and method are provided for applying fitments onto packages. The present invention includes the steps of: applying an adhesive to a fitment (26); allowing the adhesive to solidify; introducing the fitment to a fitment applicator machine; conveying the fitment to a heating station where the adhesive is reactivated (34); providing mechanical means for picking up a fitment (40); introducing a package to the applicator machine (38); and conveying the package to a position wherein a fitment may be placed on a package and secured thereto (40).