LOW DIELECTRIC INORGANIC COMPOSITION FOR MULTILAYER CERAMIC PACKAGE

摘要

LOW DIELECTRIC INORGANIC COMPOSITION FOR MULTILAYER CERAMIC PACKAGE A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2 at 1 MHz and a linear thermal expansion coefficient of 2.5-3.0 ppm/.degree.C. from room temperature to 200.degree.C. The composition comprises a mixture of finely divided particles of 20-50 wt.% borosilicate glass, 40-75 wt.% titanium silicate glass and where necessary sufficient amounts of crystalline ceramic material to inhibit the formation of crystalline forms of silica. The composition can be used with a polymeric binder to produce an unfired green tape which is co-fireable with high conductivity metallurgies such as gold, silver and silver/palladium.