| 摘要 |
<p>PURPOSE:To provide a small-sized, lightweight semiconductor device of improved quality using a tape carrier. CONSTITUTION:A tape carrier 1 has a device hole of a size the same as or smaller than a semiconductor device 6. The length of inner leads 3a of the device, extending from the device hole, is limited to the electrode length of the device plus the amount of lead forming. Therefore, the distance between the device hole and the electrode can be minimized, thereby increasing mounting density. In addition, the distance between the electrode 6a of the device and the edge of the device hole is several tens of microns, so it is possible to prevent edge short-circuiting due to reverse lead forming.</p> |
