| 摘要 |
PURPOSE:To prevent electromagnetic wave noises from going in and out of an integrated circuit device by employing a proper wiring structure. CONSTITUTION:Conductive layers such as a polycrystalline Si layer 14 and a metal layer 22 are formed above and beneath a wiring layer 18 along its longitudinal direction and conductors such as metal layers 18a and 18b are formed on the left side and the right side of the wiring layer 18 along its longitudinal direction by a multilayer interconnection technology. These conductive layers and conductors are connected to each other and connected to a grounding terminal to construct an electromagnetic shield. The electromagnetic shield effectively suppresses electromagnetic wave noises which are emitted by the wiring layer 18 to jump into the other circuit parts and are emitted by the other circuit parts to jump into the wiring layer 18, so that the degree of freedom for layout can be improved. |
