| 摘要 |
PURPOSE:To provide a terminal joining structure of an electronic part resistant against a thermal cycle generated during the use of the electronic part having a plurality of joining points. CONSTITUTION:A terminal 7 introduced from a flexible substrate 3 is constituted of a base film 4, a bare wire portion 7b where a cover film 5 is removed, and a terminal portion 7c having a base film 4a formed at the tip end. The terminal portion 7c having the base film 4a and a terminal 2 of a liquid crystal panel 1 are positioned, to be pressed from above the base film 4a, followed by thermal reflow soldering. The terminal 7 is bent at 90 deg.. Consequently, a plurality of both terminals can be accurately lapped, a quality of lap joint portions can be stabilized, and a thermal stress of the joint portion in a thermal cycle can be reduced. |
