WAFER INTEGRATED CIRCUIT AND WIRING METHOD THEREFOR,申请号JP19910208260-传众专利搜索

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发明名称	WAFER INTEGRATED CIRCUIT AND WIRING METHOD THEREFOR
摘要
申请公布号	JPH0547994(A)	申请公布日期	1993.02.26
申请号	JP19910208260	申请日期	1991.08.20
申请人	FUJITSU LTD	发明人	HIRAIWA KATSURO;YURINO TAKAHIRO
分类号	H01L23/538	主分类号	H01L23/538
代理机构		代理人
主权项
地址

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