| 摘要 |
PURPOSE:To obtain a capillary tip capable of stitching and bonding metallic wires and the inner leads of a lead frame with sufficient firm joint strength and a semiconductor device stitched and bonded with sufficiently firm joint strength. CONSTITUTION:An inserting hole 9a, through which a metallic wire is passed, is formed at the axial center of a capillary tip 9. An inner projecting curved surface 91 having the radius of curvature IR is formed to the inner circumferential end face of the front end of the capillary tip 9. An outer projecting curved surface 92 having the radius of curvature OR of twice or more of the diameter of the metallic wire is shaped to the outer circumferential end face of the front end of the capillary tip 9. A load surface 93 is formed to the end face of the front end of the capillary tip 9 at the angle of 0 deg.-4 deg. to a plane orthogonal to the axial center. |
