| 摘要 |
PURPOSE:To relieve the extraordinary bending force acting on the members within the cavities by providing dummy cavities at the runner parts of the cavity arranging parts for the products, in molding semiconductors and the like. CONSTITUTION:In cavity arranged parts 2 for the products of a molding die 1, a liquefied molding resin is injected through runners 3 in a large number of cavities provided in parallel in one-line shape at both sides of each of the runners 3. In the thus molded runners 3 there are provided dummy cavities 4 in the vicinity of the cavity arranged part 2 for the products. Accordingly, upon injection of the resin, a part of the resin is branched to the dummy cavities 4, whereby the extraordinary bending force acting on the members within the respective cavities in the cavity arranged part 2 for the products can be relieved, and voids introduced in the products can be largely decreased. |
