| 摘要 |
In an electrical via structure and fabrication method that is particularly suited to coplanar contact solar cells, an initial opening (48a, 48b) through the substrate is coated and substantially closed with a dielectric material (52, 80). An inner opening is then formed through the dielectric, and the via is provided with a conductive coating (54). The dielectric is initially applied in a liquid state and is thereafter cured to a solid. The need for strong chemical etchants to smooth the via opening prior to application of the dielectric and metallization is eliminated, and a polyimide dielectric on a GaAs/Ge solar cell has resulted in a substantial improvement in leakage resistance and cell efficiency. <IMAGE> |
