METHOD FOR MAKING THICK FILM/SOLDER JOINTS

摘要

EL ?87 TITLE Method for Making Thick Film/Solder Joints A method for making a thick film/solder joint comprising the sequential steps of: (1) applying a layer of first thick film conductor paste to an electrically non-conductive substrate in a pattern which has preselected solder pad areas and firing the layer; (2) applying over the first thick film layer only within the solder pad area a layer of a second thick film conductor paste having a low frit content and firing the layer; and (3) forming the solder joint by applying to the fired second thick film layer a layer of soft solder.