| 摘要 |
PURPOSE:To enable measurement with high accuracy while removing the strain of a waveform by bringing a coaxial high-frequency probe into contact with a pad fitted to a semiconductor wafer and testing the circuit of the wafer on its test but fast sticking the probe applying an input signal and a monitor probe at that time and bringing each nose section into contact with the same pad. CONSTITUTION:The nose of a coaxial high-frequency probe for a test is brought into contact with a pad fitted to a semiconductor wafer 17 for the on-wafer test. The probe applying an input signal and a probe for a monitor are arranged in parallel under the contacting state at that time, and formed integrally. That is, a coaxial external conductor 11 with a central conductor 15, an exposed tip 18 thereof is bent sharply, and a coaxial external conductor 12 with a central conductor 16, an exposed tip 19 thereof is bent similarly, are boundled, and each tip 18 and 19 is brought into contact with the pad. Signals are applied and outputs are lead out by using external connecting connectors 13 and 14 fitted at other ends of each conductor 11 and 12. |
