发明名称 MOLD DIE FOR MANUFACTURING OPTICAL MODULE AND MANUFACTURING METHOD USING THE SAME
摘要 An optical module is manufactured by using a mold die including cavity portions (11), (21) for holding an optical connector (34), electronic circuit parts, and lead pins which constitute component parts of the optical module, so as to form a package; alignment portions (12), (22) in which rectangular channels (12b), (22b) for aligning the optical connector (34) are formed; and partition plates (23), (27) disposed vertically between the cavity portions (11), (21) and the alignment portions (12), (22) and adapted to prevent a resin from flowing out from the cavity portions (11), (21) during resin molding. <IMAGE>
申请公布号 EP0496331(A3) 申请公布日期 1993.02.24
申请号 EP19920100871 申请日期 1992.01.20
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 GO, HISAO;MATSUMURA, YUTAKA
分类号 B29C45/02;B29C33/00;B29C45/14;B29C45/26;B29C70/72;B29K105/20;B29L11/00;B29L31/36;G02B6/42;H04B10/00;H04B10/25 主分类号 B29C45/02
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