发明名称 |
Surface mount device with high thermal conductivity |
摘要 |
A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.
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申请公布号 |
US5188985(A) |
申请公布日期 |
1993.02.23 |
申请号 |
US19920871446 |
申请日期 |
1992.04.21 |
申请人 |
AEGIS, INC. |
发明人 |
MEDEIROS, III, MANUEL;GREENSPAN, JAY S. |
分类号 |
H01L23/043;H01L23/045 |
主分类号 |
H01L23/043 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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