| 摘要 |
PCT No. PCT/US92/06155 Sec. 371 Date Oct. 26, 1994 Sec. 102(e) Date Oct. 26, 1994 PCT Filed Jul. 20, 1992 PCT Pub. No. WO93/01914 PCT Pub. Date Feb. 4, 1993A process for superpolishing hard ceramic substrates, and super polished substrates having surface finishes below about 20 angstroms RMS. In the first embodiment, the process comprises applying a pitch to a lap tool and forming channels in the pitch. The pitch is wetted with a polishing compound comprising colloidal alumina and powder of a substance harder than that being polished. The substrate is brought into contact with the wetted pitch, and relative motion is applied thereto to polish the substrate. In a second embodiment, microporous pads are used which absorb the polishing compound and contact the substrate to polish the same. |
