| 摘要 |
A plane antenna 2 and a receiving circuit 5 are formed on one and the same semiconductor substrate 1. Both can be connected by a microstrip line 7, and so on. Resultantly the receiving device as a whole can be small-sized and light. Furthermore, the plane antenna, the receiving circuit, and the microstrip line can be integrated by the common IC process, and the fabrication cost can be drastically reduced.
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