| 摘要 |
<p>PURPOSE:To obtain the subject film useful for the connection of semiconductor element and the mounting of a semiconductor device on an external board, etc., effective for facilitating the connection work, etc., and producible at a low cost by coating a surface of a film with a layer of a specific adhesive flowable by hot-pressing. CONSTITUTION:An adhesive layer 8 [produced by using an adhesive having a glass transition point (Tg) of <=150 deg.C (preferably epoxy resin, etc.)] flowable by pressing under heating is formed on one surface of an insulation film 3' such as polyester resin film to obtain the objective film 3a. A film carrier 3 is produced by forming plural through-holes 7 in a prescribed region on an insulation film, forming a connection lead 4 having a prescribed pattern on one surface of the above film, extending the connection part of the connection lead 4 to the above region and bonding the objective adhesive film 3a utilizing the bonding force of the adhesive layer to the surface of the insulation film having the connection lead 4 in such a manner as to cover a part of the above region with the adhesive film. The film carrier is used as the connection part for a semiconductor element 1.</p> |
