| 摘要 |
<p>PURPOSE:To improve a strength and to improve stress-resistance characteristic corresponding to that of an alumina board by forming it of a low temperature sintered multilayer board in which a low melting point metal material is used as a wiring material, glass-based overcoating on the board, and an organic resin coating on the overcoating. CONSTITUTION:Conductors 1 and trimmed 5 resistors 2 are provided on a rear surface of a low temperature sintered multilayer board, and an overcoating glass layer 3 and an organic resin coating layer 4 are provided thereon. The layer 3 is provided on the conductors 1 on a front surface, and an electronic component is placed. That is, it is formed of the board in which a low melting point metal selected from a silver, a silver series noble metal alloy, gold, gold- based noble metal alloy, copper and nickel is used as a wiring material, glass- based overcoating 3, and an organic resin coating. According to this, its strength is improved by about 1.4 times as large as that coated with resin, and its stress- resistance characteristic is improved corresponding to that of an alumina board.</p> |
