SEMICONDUCTOR MODULE FOR POWER

摘要

PURPOSE:To prevent a semiconductor chip from being damaged when the chip is sealed with an epoxy resin at the time of constituting a semiconductor module for power. CONSTITUTION:A grid-like or ladder-like terminal supporting frame 11 which is integrally formed with a terminal member 7 is provided between a silicone rubber layer 9 which is formed for sealing the upper surface of a semiconductor chip 4 and an epoxy resin layer 10 and, at the same time, an air space 13 is formed in the frame 11 by mounting an insulating substrate 12 on the frame 11 so that the pressure applied to the layer due to the thermal expansion of the epoxy resin injected into a space above the space 13 when the epoxy resin is cured by heating can be released into the space 13 in the frame 11.