PACKAGING METHOD OF SEMICONDUCTOR CHIP,申请号JP19910196248-传众专利搜索

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发明名称	PACKAGING METHOD OF SEMICONDUCTOR CHIP
摘要
申请公布号	JPH0541401(A)	申请公布日期	1993.02.19
申请号	JP19910196248	申请日期	1991.08.06
申请人	FUJITSU LTD	发明人	YAMADA KAZUYUKI
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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