发明名称 MOLDED CASE FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To provide a molded case in which a mold is inexpensive, a strength of a product is strong and an external appearance is satisfactory in the molded case for a communication terminal device, etc., and particularly an improvement for a vent port. CONSTITUTION:In a case in which outer walls 21 each having a thickness smaller than 1/2 of a thickness of a case wall 2 and an outer surface coincident with that of the wall 2, and inner walls 22 each having a thickness smaller than 1/2 of a thickness of the wall 2 and an inner surface coincident with that of the wall 2, are alternately arranged in a zigzag manner thereby to array recesses 4 at desired positions of the wall 2 in one row in such a manner that gaps between the walls 21 and 22 formed on the sidewalls of the recesses 4 are used as vent ports 5, arc-shaped sectional protrusion stripes 25 are formed on a center line of the inner surface 21A of the outer wall 21.
申请公布号 JPH0541581(A) 申请公布日期 1993.02.19
申请号 JP19910195133 申请日期 1991.08.05
申请人 FUJITSU LTD 发明人 SATO KAZUHIRO
分类号 B29C45/37;B29L31/34;H05K5/02;H05K7/20 主分类号 B29C45/37
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