| 摘要 |
PURPOSE:To accurately and stably place an electronic component formed at an electrode surface of fine spherical solders on a board. CONSTITUTION:The electronic component placing apparatus comprises a flux coating mechanism 1 which can uniformly apply a predetermined quantity of flux, a flux drying mechanism 2 for improving flux viscosity, an alignment pawl 21 for aligning a component by a low impact, an optical system 5 which can accurately detect an electrode position of an electronic component, and a placing head 4 for applying a predetermined back pressure to the electronic component and placing the electronic component on a board. |
