| 摘要 |
PURPOSE:To provide an IC suction device in which an accidental incapability of sucking IC and an accidental cruch of IC and the like are not generated by absorbing the high low difference generated by the error of parallel between a X-Y drive mechanism and an IC placed surface, in an IC carrying device adopting a horizontal carrying process. CONSTITUTION:A penetrating hole 5B in which a suction pad unit 5C is stored, is formed on a hot chuck 5A and a gum pad 5D in which IC is sucked, is mounted on the lower end of this suction pad unit 5C and an sucked IC is brought into contact with the hot chuck 5A so that the IC can be heated. The suction pad unit 5C is supported so as to be able to move up and down and IC is sucked in a status which the gum pad 5D is projected largely by this movement and after suction, the gam pad 5D is moved upward so that the IC can come into contact with the hot chuck 5A. |
