LEISTUNGSHALBLEITERMODUL.

摘要

The package is made of plastic and has a ceramic base. For attachment to a heatsink by screw it has a central hole. On the inner surface of the ceramic base are metal traces to which the semiconductor chips, connectors and internal attachments are soldered. The substrate is provided with a thick copper-layer on the underside and a ring-shaped Cu-layer on the top both made by direct attachment of Cu-foil pref. 0.1-0.5 mm thick, pref. 0.3 mm. The other traces on the top-surface are made out of the same foil. An outer ring may be used optionally.