| 摘要 |
PURPOSE:To reduce the sealing area and to utilize the flexibility of the film to the maximum extent by installing a sealing frame whose size is smaller than that of the device hole for mounting the IC which is formed on a film carrier in said device hole, and sealing the IC by resin. CONSTITUTION:On a flexible film 1, is formed a device hole 18 having recessed part 18a which serve the roles of positioning and a stopper. Fingers 2b of a circuit substrate 10, which is formed by processing such as tin plating and the like on a copper pattern and pipes 3a which are formed at the electrode parts of an IC 3, are bonded by thermal compression. Then, convex parts 16a for positioning the sealing frame 16 are inserted into the recesses 18a of the device hole 18. While, the sealing frame 16 is placed on the fingers 2b. Thereafter, sealing resin 7 is injected from a resin injecting hole 16b by using a resin injecting device and the like. The resin is cured in a circulating type hot-wind drying oven. The sealing frame 16 comprises materials such as resin, metal, ceramics, and the like. |
