LIQUID FILM INTERFACE COOLING CHUCK FOR SEMICONDUCTOR WAFER PROCESSING

摘要

A liquid interface cooling chuck assembly 10 includes a clamping section 12 having a top surface 16 with three separate cooling circuit grooves machined therein and a bottom surface 64 having a double spiral cooling circuit machined therein. The clamping section 12 is soldered to the flat top surface 18 of the support section 14 which as a bottom surface having structural ribs machined therein. Liquid is provided to the three cooling circuits of clamping section 12 to provide a liquid interface between a wafer and the top surface 16 of the clamping section 12. A cooling fluid is also circulated through the bottom surface cooling circuit.