发明名称 RFI/EMI reduction for head and disk assembly
摘要 Apparatus providing improved RFI/EMI shielding includes a base of conductive material, such as cast or forged aluminum alloy, the base defining a substantially continuous floor and integrally formed base sidewalls extending upwardly from the floor along the periphery thereof. The base sidewalls define an inset-stepped region above an upper outer peripheral ledge extending around the periphery of the base sidewalls. A plurality of closely spaced apart, knife-blade protrusions formed along the edge extend upwardly from the ledge and angle inwardly toward the base sidewalls within the inset-stepped region. A cover, substantially congruent with the base defines a ceiling and integral cover sidewalls extending downwardly to fit closely over the inset-stepped region so as to come into engagement with the knife-blade protrusions. A clamping arrangement, such as plural spaced apart screws passing through peripheral openings of the cover and entering threaded bores in the base for example, cause the cover securely to clamp down over the base such that facing portions of the cover are deformed over the knife-blade protrusions of the base, thereby establishing very low impedance, closely spaced apart contacts along the gap between the cover and base, for grounding out RFI/EMI.
申请公布号 US5187621(A) 申请公布日期 1993.02.16
申请号 US19910674385 申请日期 1991.03.25
申请人 QUANTUM CORPORATION 发明人 TACKLIND, THOMAS A.
分类号 G11B23/50;G11B33/14 主分类号 G11B23/50
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