发明名称 |
Method of manufacturing semiconductor devices |
摘要 |
In a method of manufacturing semiconductor devices by using a semiconductor wafer having a circuit area in which a circuit pattern is to be formed and a character printing area in which a lot number pattern for recording characters used for product management is to be formed, etching the surface of the semiconductor wafer to form the lot number pattern in the character printing area, forming a metallic layer over the surface of the semiconductor wafer, and selectively removing the portion of the metallic layer located on the circuit area but not used as the circuit pattern and the portion of the metallic layer located on the character printing area simultaneously.
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申请公布号 |
US5187118(A) |
申请公布日期 |
1993.02.16 |
申请号 |
US19900570828 |
申请日期 |
1990.08.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OHMORI, MASASHI;MIDOU, YOUICHI |
分类号 |
H01L21/02;H01L23/544 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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