| 摘要 |
This invention relates to a die bonding method used for adhering the die of a semiconductor device to a die pad of lead frame. Adhesive paste is applied in spots on the surface of the die pad by means of plural nozzles arranged radially, pressing a die thereon to spread the adhesive paste widely, and adhere the die to the die pad by hardening the adhesive paste. When the plural nozzles are arranged radially in this manner, the adhesive paste applied in spots on the die pad surface is also radial. Accordingly, when the die pad is pressed on, the adhesive paste spreads widely along the back surface of the die while forcing out air, thereby preventing voids from staying inside the adhesive paste. As a result, the die adhesion strength is increased, and the thermal and electrical conductivity are improved.
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